Ultrasonic suspension

By Dasha Katkova

Project snapshot

A kit-built levitation device

I used a kit to assemble an ultrasonic suspension device that can levitate foam balls.

The materials I used are:

  • 2 green chip LEDs
  • 2 chip resistors, 10 kΩ
  • A power driver chip
  • A microcontroller
  • Electronic capacitor: 10 µF, 25 V
  • A connector port, 12 V
  • A voltage regulator chip
  • 4 chip capacitors
  • 4x1 pin header
  • 2 ultrasonic transducers
  • 4 screws
  • 4 large standoff spacers
  • 4 tiny standoff spacers

I began soldering all the chip components to the PCB.

Soldered PCB for the ultrasonic suspension device

I gathered all my parts to begin the full assembly.

Parts gathered for the ultrasonic suspension assembly

I screwed it on so it could stand on its own. I made sure that the transducers were far apart.

Partially assembled ultrasonic suspension device standing on spacers

I made sure to test it with foam balls.